Job Summary: 1. New Package Technology and New Platform Module Development o Responsible for new package/technology development following Advanced Product Qualification Plan (APQP). o Good understanding of MRS and generate PRS with SCD definition. o Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal. o Familiar with DFM, to secure robust manufacturability with quality requirements. o Good understanding of power module package design rule, design rule update with new platform development. o Generate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, etc.). o Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.). o Drive problem solving methodology with risk assessment to find technical issue and provide systematic solution. o Strong knowledge and in-depth understanding of device-package inter****. o Effectively working with team for on time development. 2. Technical Project Management and Communication o Responsible for defining and ensuring adherence based on technical requirement, quality requirement, project timing and cost. o Strong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition. o Supporting to track and remind team members for tasks, deliverables, milestones of projects, successfully work with PM to be developed on time. o Participate in all project/gate review, alignment with team. Qualifications1. At least 7 + years working experience in SMT/ Die attach/ Ag sintering, WB/ DS is a plus. o Experienced areas: Power module package (transfer molded, gel filled) development, DSC experience is plus. o Experienced packages: Transfer molded power module (Intelligent Power Module, Case Module, DSC experience is plus). 2. Education: BS or MS degree. 3. Skills: o Fluent with English communicationo familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (ppt presentation). 4. Personal characteristics: self-motivated, independent, open mind to communicate, willing to take risk and managing. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets, onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, ****native energy, and factory automation. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for onsemi to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by 2040.

安森美（onsemi, 納斯達克股票代碼: ON)正推動顛覆性創(chuàng)新，幫助建設更美好的未來！公司專注于汽車和工業(yè)終端市場，正加速推動大趨勢的變革，包括汽車功能電子化和安全、可持續(xù)能源網(wǎng)、工業(yè)自動化以及5G和云基礎設施等。 安森美總部位于美國亞利桑那州鳳凰城，在全球范圍內擁有約30,000名員工，公司在北美、歐洲和亞洲擁有設計中心、解決方案工程中心和制造工廠。 安森美堅持并踐行對道德、環(huán)境可持續(xù)性和負責任的商業(yè)實踐的承諾。 安森美蘇州工廠，即快捷半導體（蘇州）有限公司，是安森美在中國設立的一家封裝與測試工廠，成立于2002年2月。蘇州工廠主要產品有分立器件，智能模塊，汽車模塊和汽車高功率模塊。除制造職能外，蘇州工廠還設有產品與測試研發(fā)中心，封裝工藝研發(fā)，可靠性和失效分析試驗室。 2020年至2024年，蘇州工廠連續(xù)5年榮獲“大蘇州最佳雇主”！